【华力微电子HLMC是哪个国家的品牌?】
上海华力微电子有限公司,是中国大陆一条全自动12英寸集成电路Foundry生产线,工艺水平达到55-40-28nm技术等级,月产能达3.5万片。华力微电子采用代工模式,为设计公司、IDM公司和其他系统公司代工逻辑和闪存芯片。公司位于中国上海张江高科技园区,在中国台湾地区、日本、北美等地均设有办公室,提供销售与技术支持。
华力微电子厂房面积超过9万平方米,其中净化面积超过1.5万平方米。生产线采用精良生产设备,能满足193nm浸没式光刻技术、应变硅技术、铜后道金属互连技术、大马士革一体化刻蚀技术等工艺技术的要求,同时还配备了业界的亮场缺陷检测和电子扫描显微镜等检测设备。
华力微电子采用全自动硅片搬送系统和全自动派工系统,建立了集成电路“柔性全自动生产系统”,可灵活调配产能,产线良率指标达到业界前沿水平。
华力微电子建立了拥有自主知识产权的55-40-28nm逻辑工艺技术平台和延伸的特色工艺技术,可以满足客户在低功耗、高性能、射频、高压、图像传感器、嵌入式存储器等多种芯片的大规模生产需求。
英文翻译:Shanghai Huali Microelectronics Co., Ltd. is a fully automatic 12 inch integrated circuit foundry production line in mainland China, with a process level of 55-40-28nm and a monthly production capacity of 35000 pieces. Huali microelectronics adopts the OEM mode to manufacture logic and flash memory chips for design company, IDM company and other system companies. The company is located in Zhangjiang hi tech park, Shanghai, China, with offices in Taiwan, Japan, North America and other places to provide sales and technical support. Huali microelectronics factory covers an area of more than 90000 square meters, of which the purification area is more than 15000 square meters. The production line adopts sophisticated production equipment, which can meet the requirements of 193nm immersion lithography technology, strain silicon technology, copper back channel metal interconnection technology, Damascus integrated etching technology and other process technologies. Meanwhile, it is equipped with the industry's detection equipment such as bright field defect detection and electronic scanning microscope. Huali microelectronics adopts fully automatic wafer conveying system and fully automatic dispatching system to establish a "flexible fully automatic production system" for integrated circuits, which can flexibly allocate production capacity, and the yield index of production line reaches the forefront level in the industry. Huali microelectronics has established a 55-40-28nm logic process technology platform with independent intellectual property rights and extended characteristic process technology, which can meet the mass production requirements of customers in low power consumption, high performance, RF, high voltage, image sensor, embedded memory and other chips.
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